www.techpowerup.com/295983/amd-ryzen-7000-zen-4-launch-date-and-lineup-revealed-spectacular-am4-rumor-surfaces Mounting pressure almost doubled. which should help with heat transfer, but might require a new mounting kit # Granite Rapids itself is just the compute die without memory controller for applications like Ethernet. Memory controller dies get added for the HCC (high-core-count) and XCC (extreme core count) variants. HCC has 1 MC with 4 channels, XCC has 2 MC with 8 channels # www.techpowerup.com/295709/amd-announces-the-zen-5-microarchitecture-and-epyc-turin-processor-on-4nm

www.techpowerup.com/282692/amd-ryzen-8000-series-processors-based-on-zen-5-architecture-reportedly-codenamed-granite-ridge Depending on FinFlex cell: 11%–33% speed improvement, 12%-30% power reduction, 0.64x to 0.85x area improvement www.techpowerup.com/279472/intel-lunar-lake-microarchitecture-hits-the-radar-possible-meteor-lake-successor www.techpowerup.com/284210/samsung-5-nm-node-struggles-with-yields-reports-indicate-less-than-50-yieldingwww.techpowerup.com/266368/samsung-to-commence-5nm-euv-mass-production-in-q2-2020-develop-3nm-gaafet-node www.techpowerup.com/301057/zen-4-x3d-limited-to-8-core-and-6-core-no-meteor-lake-in-2023-frosty-year-expected-for-cpu-market Leaked low-power configuration: 17 W, 4+4, 20c 3.91 GHz + 2.61 GHz, 5M, 3.3 GHz IMC, 4x 2.5 MB + 4 MB L2, 2x 8 MB L3 #

Includes low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency According to a newer report, both Samsung and TSMC are struggling with yields for their 3 nm node # www.techpowerup.com/295712/amd-cdna3-architecture-sees-the-inevitable-fusion-of-compute-units-and-x86-cpu-at-massive-scaleGranite Rapids AP supports up to 2 CPUs, 12 channels DDR5 per CPU, DDR5 6400 MT/s 1 DPC / 5200 MT/s 2 DPC, 24 DIMMs per CPU #